1. COF (CHIP on Flex, OR, Chip On Film), often referred to as a crystal thin film. It is a grain soft film installation technology that fixes integrated circuits (IC) on the flexible line board. The soft additional circuit board is used as a packaging chip carrier to combine the chip and the soft substrate circuit, or the soft additional circuit board with unpackaged chips, including roll band packaging production (TAB substrate, its process is called TCP), soft board connection chip components, soft IC carrier panel packaging. 2, COF index, called abolition index. The generation of this index is because the level in the team when the team is higher than that of my level 7 or above, (after the eighth chapter is revised, including the people or masters of their own family). COF.
The application and development trend COF has the function of connecting panels, but also carries main passive components to make the product more thinner. At present, COF technology has been successfully applied to the LCD panel. It is expected that driven by mobile phones, laptops, LCD displays and other products, it will soon become the mainstream of the future market. And because the COG technology is deformation due to stress concentration due to stress concentration, it is difficult to repairs when problems occur. . The TAB technology uses three layers of plastic panels, which is not as deflection and stability as COF. Mainly, it has developed into various medium -sized panels, and even has important applications in plasma panels and future mechanical electrical light panels. It, people can also install more than one IC chip on the FPC substrate to form a COF of MCM to further increase the packaging density; The yield is reduced to the human operation error, so that the production of COF has reached a new level. The above content reference: Baidu Encyclopedia-COF, Baidu Encyclopedia-COF Index
COF (Chip On Flex, OR, Chip On Film is often referred to as a crystal thin film): Fixing the driving IC on the flexible circuit board on the crystal grain soft film constructing technology. Technologies of sexual base board circuit. This can make the most fine lines. It is reported that there are already lines with a successful line of the company's trial production line with 3 μm. Another advantage of this method is to use thick light -sensitive dry membranes to increase the thickness of the line. If it reaches 8 times the thickness ratio, it can inhibit the problem of increasing DC resistance (R) when the line refined. However, this method needs to be used for semiconductor manufacturing. The process is complicated and the cost is high. Plores of the opposite sex conductive film connection process: ACF material scattered the fine metal particles or metal plastic plastic plastic plastic plastic balls in the resin material, exist in the form of film in the B -order state. When the ACF is fitted between the convex block and the substrate line of the IC, the resin starts with appropriate pressure, temperature and time, and the conductive particles are connected to the convex block and substrate lines to achieve electrical conduction. At the same time, due to the use of proper electrical particle particles and adding amounts, it makes it unable to contact each other between the convex and the convex blocks to achieve the characteristics of the opposite sex. There are various types of ACFs on the market, but the most useful gold-plated plastic balls with a diameter of 3-5 μm are used. The above reference: Baidu Encyclopedia-COF
Pay content for time limit to check for freenAnswer Hello! I'm glad to answer it for you!nYou ask COF Process Engineersnjob descriptionn1. Have good execution to ensure that it can achieve the task of competing in charge.n2. Details of production operation management implementation rules, operation specifications and operating standards.n3. Process material cost analysis and controln4. Responsible for the improvement of the product process, investigate and deal with an abnormal accident, and take preventive measures.n5. Responsible for the optimization and management of process parameters; the revision and review of the process filen6. Improvement and rationalization assessment of client demandn7. Process C/T improvement and improvementn8. Other tasks delivered by the bossnMore 9nBleak
The higher the COF value, the less rewards you get. If your COF is 40 %! Then the reward you get the task is only 60 %! Including only experience and money. Equipment, consumables and materials will not be reduced! The COF value is complete without less than 5 %! Many people say that it will affect the drop rate! But I don't think! How can there be COF? That is the consequences of finding people when you usually brush the picture, and the team that is higher than the level 7 of your own level will add a COF value! The COF value is calculated by fatigue. If you are in total (it is all, from your character to forever), you have brushed 100 fatigue, 50 of which are brushed with senior players, then your COF value is 5 % ten! The only way to reduce the COF value is to brush more fatigue. It is recommended to brush Laurn, which is fast enough! If you want to reduce, don't rush to upgrade! After the upgrade, the COF value will be updated! It is completely okay to keep as much as possible within 5 %! The adoption of me, typing is very tired!
When there are people who have more than 7 levels of your level, you will bring you pictures and this person is not your master or guild. COF will be added. Upgrading, bringing people, and single brushes will reduce COF. COF affects the task to obtain experience and gold coins. There is no effect, it does not affect the explosion rate. If you do n’t understand
1. COF (CHIP on Flex, OR, Chip On Film), often referred to as a crystal thin film. It is a grain soft film installation technology that fixes integrated circuits (IC) on the flexible line board.
The soft additional circuit board is used as a packaging chip carrier to combine the chip and the soft substrate circuit, or the soft additional circuit board with unpackaged chips, including roll band packaging production (TAB substrate, its process is called TCP), soft board connection chip components, soft IC carrier panel packaging.
2, COF index, called abolition index. The generation of this index is because the level in the team when the team is higher than that of my level 7 or above, (after the eighth chapter is revised, including the people or masters of their own family). COF.
The application and development trend
COF has the function of connecting panels, but also carries main passive components to make the product more thinner. At present, COF technology has been successfully applied to the LCD panel. It is expected that driven by mobile phones, laptops, LCD displays and other products, it will soon become the mainstream of the future market. And because the COG technology is deformation due to stress concentration due to stress concentration, it is difficult to repairs when problems occur.
. The TAB technology uses three layers of plastic panels, which is not as deflection and stability as COF. Mainly, it has developed into various medium -sized panels, and even has important applications in plasma panels and future mechanical electrical light panels.
It, people can also install more than one IC chip on the FPC substrate to form a COF of MCM to further increase the packaging density; The yield is reduced to the human operation error, so that the production of COF has reached a new level.
The above content reference: Baidu Encyclopedia-COF, Baidu Encyclopedia-COF Index
COF (Chip On Flex, OR, Chip On Film is often referred to as a crystal thin film): Fixing the driving IC on the flexible circuit board on the crystal grain soft film constructing technology. Technologies of sexual base board circuit.
This can make the most fine lines. It is reported that there are already lines with a successful line of the company's trial production line with 3 μm. Another advantage of this method is to use thick light -sensitive dry membranes to increase the thickness of the line. If it reaches 8 times the thickness ratio, it can inhibit the problem of increasing DC resistance (R) when the line refined. However, this method needs to be used for semiconductor manufacturing. The process is complicated and the cost is high.
Plores of the opposite sex conductive film connection process:
ACF material scattered the fine metal particles or metal plastic plastic plastic plastic plastic balls in the resin material, exist in the form of film in the B -order state. When the ACF is fitted between the convex block and the substrate line of the IC, the resin starts with appropriate pressure, temperature and time, and the conductive particles are connected to the convex block and substrate lines to achieve electrical conduction.
At the same time, due to the use of proper electrical particle particles and adding amounts, it makes it unable to contact each other between the convex and the convex blocks to achieve the characteristics of the opposite sex. There are various types of ACFs on the market, but the most useful gold-plated plastic balls with a diameter of 3-5 μm are used.
The above reference: Baidu Encyclopedia-COF
Pay content for time limit to check for freenAnswer Hello! I'm glad to answer it for you!nYou ask COF Process Engineersnjob descriptionn1. Have good execution to ensure that it can achieve the task of competing in charge.n2. Details of production operation management implementation rules, operation specifications and operating standards.n3. Process material cost analysis and controln4. Responsible for the improvement of the product process, investigate and deal with an abnormal accident, and take preventive measures.n5. Responsible for the optimization and management of process parameters; the revision and review of the process filen6. Improvement and rationalization assessment of client demandn7. Process C/T improvement and improvementn8. Other tasks delivered by the bossnMore 9nBleak
The higher the COF value, the less rewards you get. If your COF is 40 %! Then the reward you get the task is only 60 %! Including only experience and money. Equipment, consumables and materials will not be reduced! The COF value is complete without less than 5 %! Many people say that it will affect the drop rate! But I don't think! How can there be COF? That is the consequences of finding people when you usually brush the picture, and the team that is higher than the level 7 of your own level will add a COF value! The COF value is calculated by fatigue. If you are in total (it is all, from your character to forever), you have brushed 100 fatigue, 50 of which are brushed with senior players, then your COF value is 5 % ten! The only way to reduce the COF value is to brush more fatigue. It is recommended to brush Laurn, which is fast enough! If you want to reduce, don't rush to upgrade! After the upgrade, the COF value will be updated! It is completely okay to keep as much as possible within 5 %!
The adoption of me, typing is very tired!
When there are people who have more than 7 levels of your level, you will bring you pictures and this person is not your master or guild. COF will be added. Upgrading, bringing people, and single brushes will reduce COF. COF affects the task to obtain experience and gold coins. There is no effect, it does not affect the explosion rate. If you do n’t understand